SLM processing of pure copper involves the layer-by-layer melting and deposition of copper powder using a high-energy laser. By employing green lasers or high-power infrared lasers to overcome copper's inherent high reflectivity and high thermal conductivity, this process enables the formation of complex structures with high density. SLM processing of pure copper represents a highly challenging yet immensely promising technology within the field of metal additive manufacturing. While its exceptional electrical and thermal conductivity render it invaluable in heat dissipation and power applications, these very properties—specifically its high reflectivity and thermal conductivity—also present significant processing difficulties. Currently, green laser technology has emerged as the mainstream approach for industrial-grade copper SLM printing, effectively resolving the critical challenge of "insufficient melting." Pure copper holds irreplaceable application value across a wide spectrum of high-tech and industrial sectors, including aerospace and defense, new energy and power systems, high-end electronics and semiconductors, industrial manufacturing and mold engineering, as well as medical and scientific research equipment.